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Socket A
Socket A (also known as Socket 462) is a zero insertion force pin grid array (PGA) CPU socket used for AMD processors ranging from the Athlon Thunderbird to the Athlon XP/MP 3200+, and AMD budget processors including the Duron and Sempron. Socket A also supports AMD Geode NX embedded processors (derived from the Mobile Athlon XP). It compliments (and later supersedes) the prior Slot A CPU interface used in some Athlon Thunderbird processors. The front-side bus frequencies supported for the AMD Athlon XP and Sempron are 133 MHz, 166 MHz, and 200 MHz. Socket A supports 32-bit CPUs only. The socket is a zero insertion force pin grid array type with 462 pins, hence the alternative name Socket 462. About nine pins in the socket are blocked to discourage accidental insertion of Socket 370 CPUs on Socket A motherboards. Socket A was replaced by Socket 754 and Socket 939 during 2003 and 2004 respectively, except for its use with Geode NX processors. Technical speci ...
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Socket 462
Socket A (also known as Socket 462) is a zero insertion force pin grid array (PGA) CPU socket used for AMD processors ranging from the Athlon Thunderbird to the Athlon XP/MP 3200+, and AMD budget processors including the Duron and Sempron. Socket A also supports AMD Geode NX embedded processors (derived from the Mobile Athlon XP). It compliments (and later supersedes) the prior Slot A CPU interface used in some Athlon Thunderbird processors. The front-side bus frequencies supported for the AMD Athlon XP and Sempron are 133 MHz, 166 MHz, and 200 MHz. Socket A supports 32-bit CPUs only. The socket is a zero insertion force pin grid array type with 462 pins, hence the alternative name Socket 462. About nine pins in the socket are blocked to discourage accidental insertion of Socket 370 CPUs on Socket A motherboards. Socket A was replaced by Socket 754 and Socket 939 during 2003 and 2004 respectively, except for its use with Geode NX processors. Technical specifi ...
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Pin Grid Array
A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package. PGAs are often mounted on printed circuit boards using the Through-hole technology, through hole method or inserted into a CPU socket, socket. PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP). Chip mounting The chip can be mounted either on the top or the bottom (the pinned side). Connections can be made either by wire bonding or through flip chip mounting. Typically, PGA packages use wire bonding when the chip is mounted on the pinned side, and flip chip construction when the chip is on the top side. Some PGA packages contain multiple dies, for example Zen 2 and Zen 3 Ryzen CPUs for the Socket AM4, AM4 socket. ...
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Newton (unit)
The newton (symbol: N) is the unit of force in the International System of Units (SI). Expressed in terms of SI base units, it is 1 kg⋅m/s2, the force that accelerates a mass of one kilogram at one metre per second squared. The unit is named after Isaac Newton in recognition of his work on classical mechanics, specifically his second law of motion. Definition A newton is defined as 1 kg⋅m/s2 (it is a named derived unit defined in terms of the SI base units). One newton is, therefore, the force needed to accelerate one kilogram of mass at the rate of one metre per second squared in the direction of the applied force. The units "metre per second squared" can be understood as measuring a rate of change in velocity per unit of time, i.e. an increase in velocity by one metre per second every second. In 1946, the General Conference on Weights and Measures (CGPM) Resolution 2 standardized the unit of force in the MKS system of units to be the amount need ...
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Die (integrated Circuit)
A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is Semiconductor fabrication, fabricated. Typically, integrated circuits are produced in large batches on a single wafer (electronics), wafer of electronic-grade Monocrystalline silicon, silicon (EGS) or other semiconductor (such as Gallium arsenide, GaAs) through processes such as photolithography. The wafer is cut (wafer dicing, diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die. There are three commonly used plural forms: ''dice'', ''dies,'' and ''die''. To simplify handling and integration onto a printed circuit board, most dies are integrated circuit packaging, packaged in List of electronic component packaging types, various forms. Manufacturing process Most dies are composed of silicon and used for integrated circuits. The process begins with the production of Single crystal, monocrystalline sili ...
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Ounce
The ounce () is any of several different units of mass, weight, or volume and is derived almost unchanged from the , an Ancient Roman unit of measurement. The avoirdupois ounce (exactly ) is avoirdupois pound; this is the United States customary and British imperial ounce. It is primarily used in the United States. Although the avoirdupois ounce is the mass measure used for most purposes, the ' troy ounce' of exactly is used instead for the mass of precious metals such as gold, silver, platinum, palladium, rhodium, etc. The term 'ounce' is also used in other contexts: * The ounce-force is a measure of force (see below). * The fluid ounce is a measure of volume. Historically, a variety of different ounces measuring mass or volume were used in different jurisdictions by different trades and at different times in history. Etymology ''Ounce'' derives from the Ancient Roman (meaning: a twelfth), a unit in the Ancient Roman units of measurement weighing about 27 ...
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Gram
The gram (originally gramme; SI unit symbol g) is a Physical unit, unit of mass in the International System of Units (SI) equal to one thousandth of a kilogram. Originally defined in 1795 as "the absolute Mass versus weight, weight of a volume of pure water equal to Cube (algebra), the cube of the hundredth part of a metre [1 Cubic centimetre, cm3], and at Melting point of water, the temperature of Melting point, melting ice", the defining temperature (0 °C) was later changed to the temperature of maximum density of water (approximately 4 °C). Subsequent redefinitions agree with this original definition to within 30 Parts-per notation, parts per million (0.003%), with the maximum density of water remaining very close to 1 g/cm3, as shown by modern measurements. By the late 19th century, there was an effort to make the Base unit (measurement), base unit the kilogram and the gram a derived unit. In 1960, the new International System of Units defined a '' ...
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Cracked Die Corner
Cracked may refer to: Television * ''Cracked'' (British TV series), a 2008 British comedy-drama television series that aired on STV * ''Cracked'' (Canadian TV series), a 2013 Canadian crime drama series that aired on CBC * "Cracked", a Season 8 (2010) episode of ''NCIS'' Other media * ''Cracked'' (magazine), American humor magazine that ran from 1958 to 2007 * Cracked.com, American humor web site, launched in 2005, associated with ''Cracked'' magazine * '' Crack'ed'', a 1987 video game * "Cracked", a 2015 song by Pentatonix from ''Pentatonix'' See also * Crack (other) *Cracking (other) Cracking may refer to: * Cracking, the formation of a fracture or partial fracture in a solid material studied as fracture mechanics ** Performing a sternotomy * Fluid catalytic cracking, a catalytic process widely used in oil refineries for crac ...
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Alpha 21264
The Alpha 21264, also known by its code name, EV6, is a RISC microprocessor developed by Digital Equipment Corporation launched on 19 October 1998. The 21264 implemented the Alpha instruction set architecture (ISA). Description The Alpha 21264 is a four-issue superscalar microprocessor with out-of-order execution and speculative execution. It has a peak execution rate of six instructions per cycle and could sustain four instructions per cycle. It has a seven-stage instruction pipeline. Out of order execution At any given stage, the microprocessor could have up to 80 instructions in various stages of execution, surpassing any other contemporary microprocessor. Decoded instructions are held in instruction queues and are issued when their operands are available. The integer queue contained 20 entries and the floating-point queue 15. Each queue could issue as many instructions as there were pipelines. Ebox The Ebox executes integer, load and store instructions. It has tw ...
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Front-side Bus
The front-side bus (FSB) is a computer communication interface ( bus) that was often used in Intel-chip-based computers during the 1990s and 2000s. The EV6 bus served the same function for competing AMD CPUs. Both typically carry data between the central processing unit (CPU) and a memory controller hub, known as the northbridge. Depending on the implementation, some computers may also have a back-side bus that connects the CPU to the cache. This bus and the cache connected to it are faster than accessing the system memory (or RAM) via the front-side bus. The speed of the front side bus is often used as an important measure of the performance of a computer. The original front-side bus architecture was replaced by HyperTransport, Intel QuickPath Interconnect, and Direct Media Interface, followed by Intel Ultra Path Interconnect and AMD's Infinity Fabric. History The term came into use by Intel Corporation about the time the Pentium Pro and Pentium II products were announ ...
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Double Data Rate
In computing, double data rate (DDR) describes a computer bus that transfers data on both the rising and falling edges of the clock signal and hence doubles the memory bandwidth by transferring data twice per clock cycle. This is also known as double pumped, dual-pumped, and double transition. The term toggle mode is used in the context of NAND flash memory. Overview The simplest way to design a clocked electronic circuit is to make it perform one transfer per full cycle (rise and fall) of a clock signal. This, however, requires that the clock signal changes twice per transfer, while the data lines change at most once per transfer. When operating at a high bandwidth, signal integrity limitations constrain the clock frequency. By using both edges of the clock, the data signals operate with the same limiting frequency, thereby doubling the data transmission rate. This technique has been used for microprocessor front-side busses, Ultra-3 SCSI, expansion buses ( AGP, PCI ...
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Socket 370
Socket 370, also known as PGA370, is a CPU socket first used by Intel for Pentium III and Celeron processors to first complement and later replace the older Slot 1 CPU interface on personal computers. The "370" refers to the number of pin holes in the socket for CPU pins. Socket 370 was replaced by Socket 423 in 2000. Overview Socket 370 started out as a budget-oriented platform for 66 MHz Front-side bus, FSB PPGA Mendocino Celeron CPUs in late 1998, as the move to on-die L2 cache eliminated the need for a Printed circuit board, PCB design as seen on Slot 1. Socket 370 then became Intel's main desktop socket from late 1999 to late 2000 for 100/133 MHz FSB FC-PGA Coppermine (microprocessor), Coppermine Pentium IIIs. In 2001, the FC-PGA2 Pentium III#Tualatin, Tualatin Pentium III processors brought changes to the infrastructure which required dedicated Tualatin-compatible motherboards; some manufacturers would indicate this with a blue (instead of white) socket. These late socket ...
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